Pfc 300
Hardware Features
- Robust design
- Octagonal, double-wall cooled, stainless chamber
- Proprietary cathode design using planar targets
- Two-cathode configuration
- Ultra-fast heating and etching (plasma and metal ion)
- Plug ‘n Play
- Plasma volume: dia 300mm, height 400mm
- Compact size: LxWxH = 2.2 x 1.4 x 2.0m
- Minimal floor space requirement = 3 x 3m
- Controlled by PLC and industrial PC
Coatings and Tolerance
- High Performance coatings: TiN, TiCN, CrN, TiAlN, AlTiN, AlTiCrN, AlCrN, AlTiSiN, HPfCAlu
- Multilayer, nanolayer and graded coatings
- Thanks to the cathode and chamber design, the tolerance on coating thickness is the best in the industry.
Throughput
- 5 to 6 batches per day in 3-shift operations
- Cycle times for 2.5 μm: TiN 2.5h, AlTiN 3h
- Full process monitoring and data logging
- Remote access through secure connection via internet